 | Prof. John WangNational University of Singapore, Singapore Prof. John Wang is a Professor in the Department of Materials Science and Engineering at the National University of Singapore and the Director of the National University of Singapore Chongqing Research Institute. He is a Fellow of the Asia Pacific Academy of Materials, the Singapore Academy of Engineering, and the Singapore Academy of Science. His research expertise spans materials science and engineering with significant contributions to advanced materials development and applications. |
 | Prof. Jin HePeking University, China Prof. JinHe has been a professor at the School of Integrated Circuits, Peking University for 21 years, and concurrently served as the Director of the Shenzhen Key Laboratory of System-on-Chip Design for 16 years. His main research areas include advanced chip technology, AI chips, and chip EDA technology. He completed BSIM4.3.0, accelerating society into the nano-chip era, and completed BSIM-FinFET, accelerating society into the digital-intelligent chip era. Prof. Jin He is a professor and doctoral supervisor at Peking University, holding multiple important academic and industry positions. Long dedicated to the field of micro/nano semiconductor devices and integrated circuits, he has led numerous national key research projects, holds dozens of invention patents, has published over 500 high-level academic papers, and possesses unique professional insights into the development of the domestic chip industry. |
 | Prof. Hongfa (Henry) HuUniversity of Windsor, Canada Prof.Hongfa (Henry) Hu is a tenured full Professor at Department of Mechanical, Automotive & Materials Engineering, University of Windsor. He was a senior research engineer at Ryobi Die Casting (USA), and a Chief Metallurgist at Meridian Technologies, and a Research Scientist at Institute of Magnesium Technology. He received degrees from University of Toronto (Ph.D., 1996), University of Windsor (M.A.Sc., 1991), and Shanghai University of Technology (B.A.Sc., 1985). He was a NSERC Industrial Research Fellow (1995-1997). His publications (over 230 papers) are in the area of magnesium alloys, composites, metal casting, computer modelling, and physical metallurgy. He was a Key Reader of the Board of Review of Metallurgical and Materials Transactions, a Committee Member of the Grant Evaluation Group forNatural Sciences and Engineering Research Council of Canada, National Science Foundation (USA) andCanadian Metallurgical Quarterly. He has served as a member or chairman of various committees for CIM-METSOC,AFS, and USCAR. The applicant's current research is on materials processing and evaluation of light alloys and composites. His recent fundamental research is focussed on transport phenomena and mechanisms of solidification, phase transformation and dissolution kinetics. His applied research has included development of magnesium automotive applications, cost-effective casting processes for novel composites, and control systems for casting processes. His work on light alloys and composites has attracted the attention of several automotive companies. |